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XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA

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XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA

Name: XCKU3PL1FFVD900I Programmable Logic Array IC 304 31641600 355950 900BBGA FCBGA
Brand: Xilinx
Price: 1 USD

Brand Name : Xilinx

Model Number : XCKU3P-L1FFVD900I

MOQ : 50pcs

Price : Negotiable

Supply Ability : 1000000pcs

Number of Logic Elements : 355950 LE

Number of I/Os : 304 I/O

Data Rate : 32.75 Gb/s

Number of Transceivers : 16 Transceiver

Mounting Style : SMD/SMT

Package / Case : FBGA-900

Brand : Xilinx

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XCKU3P-L1FFVD900I Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA

Xilinx Kintex® UltraScale+™ FPGAs

Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.

FEATURES

Programmable system integration
- Up to 1.2M System Logic Cells
- UltraRAM for on-chip memory integration
- Integrated 100G Ethernet MAC with RS-FEC and 150G Interlaken cores
Increased system performance
- 6.3 TeraMACs of DSP compute performance
- Over 2X system-level performance per watt over Kintex-7 FPGAs
- 16G and 28G backplane-capable transceivers
- 2666 Mb/s DDR4 in the mid-speed grade

BOM cost reduction
- 12.5Gb/s transceivers in slowest speed grade
- VCXO and fractional PLL integration reduces clocking component cost
Total power reduction
- Up to 60% lower power vs. 7 series FPGAs
- Voltage scaling options for performance and power
- Tighter logic cell packing reduces dynamic power
Accelerated design productivity
- Co-optimized with Vivado Design Suite for rapid design closure
- SmartConnect technology for intelligent IP integration

APPLICATIONS

112MHz point-to-point MWR modem and packet processing
1GHz eBand modem and packet processing

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